Current research in 3D heterogeneous integration focuses on improving the process's reliability, yield, and cost-effectiveness. This includes developing new materials, processes, and tools for wafer bonding, through-silicon vias fabrication, and microbump formation. There is also ongoing research into new applications for 3D heterogeneous integration, such as high-bandwidth memory, advanced sensors, and neural networks for artificial intelligence. This article gives an overview of recent development of 3D heterogeneous integration.

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S. Zhang et al. , “ Challenges and recent prospectives of 3D heterogeneous integration, ” e-Prime - Advances in Electrical Engineering, Electronics and Energy , vol. 2, p. 100052, Jan. 2022, doi: https://doi.org/10.1016/j.prime.2022.100052.